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Compute

Advanced Manufacturing for the Compute Industry

At VulcanForms, we specialize in advanced Laser Powder Bed Fusion (LPBF) solutions for the compute industry, delivering high-performance components. Leveraging high-conductivity metals such as copper, aluminum, and nickel-based alloys, our team optimizes thermal management, precision geometries, and electrical efficiency to meet the rigorous demands of next-generation computing infrastructure. From heat exchangers to liquid-cooled cold plates, we ensure compliance with industry-leading standards, enhancing reliability, scalability, and power efficiency in critical compute environments.

  • High-Performance Materials

  • Advanced Thermal Management

  • Electromagnetic Precision

  • Component Miniaturization

  • Scalable Production

  • Reduced Lead Times

Additively Manufactured Heat Sink

High Performance Alloys for Compute Applications

Advanced compute demands advanced alloys such as: copper, aluminum, and titanium to build robust thermal solutions. These high performance alloys provide superior thermal properties and corrosion resistance, ensuring optimal performance and reliability under strenuous computing loads.

aluminium

13

Al

24.305

Aluminum Alloys

Excellent corrosion resistance, electrical conductivity, and thermal management.

copper

29

Cu

63.546

Copper Alloys

Superior thermal and electrical properties.

titanium

22

Ti

47.867

Titanium Alloys

Outstanding strength-to-weight ratio, temperature resistance, and corrosion resistance.

Accelerating Next-Generation Data Infrastructure with Metal Additive Manufacturing

Our additive manufacturing capabilities enable the production of high-performance thermal management and compute components with complex geometries and optimized material properties. Using advanced Laser Powder Bed Fusion (LPBF), we manufacture custom heat exchangers, liquid cooling systems, and high-conductivity structures that enhance cooling efficiency and system performance in high-density computing environments.

Subtractive Manufacturing and Precision Machining

Our subtractive manufacturing and precision machining capabilities enable the production of high-tolerance components essential for compute infrastructure, semiconductor manufacturing, and advanced electronics. Using multi-axis CNC machining and advanced finishing techniques, we ensure tight tolerances, superior surface quality, and material integrity for heat exchangers, RF components, and high-performance computing hardware.

Our Capabilities:

  • 5-Axis Machining Cell
  • CNC Horizontal Pallet Cells
  • CNC Lathe multi axis turning
  • High-Speed Twin Pallet Cells
  • Assembly
  • CNC I.D./O.D. Cylindrical Grinding
  • EDM-Wire
  • EDM-Sinker/Plunge
  • Gun Drilling
  • Rotary Broach and Whirling
  • Surface Grinding
  • Laser Marking/Engraving
  • Bonding, Polishing, Buffing
  • Media Blasting

Ensuring Reliability and Performance Through Rigorous Testing

Our rigorous testing and validation process ensures that every compute component meets strict industry standards for reliability, thermal efficiency, and electrical performance. Through precision inspection, in-process monitoring, and post-production validation, we verify dimensional accuracy, material integrity, and functionality.

Meeting the Highest Industry Standards

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